JPH0125490Y2 - - Google Patents
Info
- Publication number
- JPH0125490Y2 JPH0125490Y2 JP1983184735U JP18473583U JPH0125490Y2 JP H0125490 Y2 JPH0125490 Y2 JP H0125490Y2 JP 1983184735 U JP1983184735 U JP 1983184735U JP 18473583 U JP18473583 U JP 18473583U JP H0125490 Y2 JPH0125490 Y2 JP H0125490Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- hollow
- printed circuit
- circuit board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000126 substance Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 14
- 239000003779 heat-resistant material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 4
- 239000010425 asbestos Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983184735U JPS60123874U (ja) | 1983-11-30 | 1983-11-30 | プリント基板用中空ピン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983184735U JPS60123874U (ja) | 1983-11-30 | 1983-11-30 | プリント基板用中空ピン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60123874U JPS60123874U (ja) | 1985-08-21 |
| JPH0125490Y2 true JPH0125490Y2 (en]) | 1989-07-31 |
Family
ID=30742220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983184735U Granted JPS60123874U (ja) | 1983-11-30 | 1983-11-30 | プリント基板用中空ピン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60123874U (en]) |
-
1983
- 1983-11-30 JP JP1983184735U patent/JPS60123874U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60123874U (ja) | 1985-08-21 |
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